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    Slide 468-50 KLENZ Purging Compound

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    Slide 465-50 KLENZ a revolutionary purging compound requiring no mixing or preparation time. KLENZ thoroughly cleanses hot runners & barrel, helping to eliminate color streaking and black specs. Formulated with a polyolefin resin carrier, klenz is safe to purge right through the mold & safe to use for food packaging applications. For use with injection molding, extrusionblow molding.

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    • Slide 465-50 KLENZ Purging Compound

      • Chemically Reactive Compound
      • Ingredients Are GRAS Rated
      • Operating Temperatures Of 330º - 610ºF

      Slide 465-50 MSDS Available from the Download Tab

      Shorten Purge Time For Your Molding Machines & Improve Process!

      Purging procedures for plastics processors. You can dramatically shorten your purge time for molding machines & improve process by reducing both time & resin.

      Watch video demonstration on Purging Procedures for Injection Molders.

      Visit Slide Instructional Videos page for more "How To" videos.